Microscopic x-ray fault finding is an advanced non-destructive testing (NDT) technique that uses high-resolution X-ray imaging to detect microscopic defects within electronic components, PCBs (Printed Circuit Boards), semiconductors, and other materials. This method is particularly useful for inspecting extremely small or densely packed components, where traditional visual inspection methods fail.
How does microscopic X-ray fault finding work?
Microscopic X-ray fault finding involves:
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- High-Magnification X-ray Imaging – Uses microfocus X-ray technology to achieve resolutions down to the micron or sub-micron level.
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- 2D and 3D Imaging– Provides detailed internal views of components without disassembly.
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- Phase Contrast and Enhanced Contrast Imaging – Allows for better visibility of low-density materials like polymer coatings or small solder joints.
What faults can microscopic X-ray fault finding detect?
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- Micro-cracks in solder joints (common in BGA, QFN, and CSP packages).
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- Voids or air pockets in solder balls.
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- Short circuits caused by tiny solder bridges.
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- Delamination or layer separation in PCBs.
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- Broken or disconnected wire bonds in semiconductors.
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- Counterfeit or tampered microchips (verifying internal structures).
What are the applications of microscopic X-ray fault finding?
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- Electronics Manufacturing – Ensures quality control in PCB assembly and microelectronics.
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- Semiconductor Industry – Inspects silicon wafers and microchip packaging defects.
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- Medical Devices – Evaluates the integrity of miniaturised medical electronics.
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- Aerospace & Automotive – Checks for structural weaknesses in critical electronics.
What are the advantages of microscopic X-ray fault finding?
✅ Non-destructive – No need to cut open or damage components.
✅ Ultra-High Precision – Can detect micro-sized defects invisible to regular X-ray.
✅ Increases Reliability – Ensures high-quality standards in production.
Request a Free Sample Inspection for AIS to evaluate your product and problem.
What type and size of things can AIS detect?
As a general statement, x-ray can identify anything which has a reasonable absorption differential to the product in which it is surrounded. Typically, we detect foreign objects such as metal and glass fragments or higher density plastics and rubber compounds.
The size of object that we can identify is influenced by the density and size of the contaminant and the product, the position of the contaminant within the pack, and the type of packaging.
Detection of missing items and quality concerns is subject to similar factors.
Find out more about our highest resolution scanner, the Micron Scan.
We will always give a clear and honest appraisal of what is achievable and be prepared to demonstrate that to you at any time.
Request a Free Sample Inspection for AIS to evaluate your product and problem.
What can the Micron Scan detect?
Our highest resolution x-ray scanner can detect extraordinarily small contaminants:
- A sieve wire of just 0.2mm in a single item
- A piece of metal just 1.0mm sphere in a multi-pack or case
- Glass fragments down to 1.0mm
- As well as stone, calcified bone and certain rubbers and plastics
What electrical goods can we inspect?
Our comprehensive range of x-ray systems is configurable to a variety of potential problems with electronic goods in both the consumer and industrial sector.
Previous projects have included quality inspection of computer peripherals, medical devices and electronic personal care items.
Please contact us for a fast and confidential assessment for your particular product.